HARBIN QIAN FAN XI FENG MACHINERY CO.LTD
diamond wire cutting machine can be used for profile and slicing of brittle materials such as sapphire, monocrystalline silicon, polycrystalline silicon, alumina, ceramics, gemstones and other materials.
Particularly suitable for profile cutting of graphite electrodes
this wire cutter Can be used to cut non-conductive materials such as jade, glass, ceramics, graphite, agate, ruby, sapphire, acrylic, monocrystalline silicon, polycrystalline silicon, silicon carbide, refractory materials, rock samples, composite materials, epoxy sheets, ferrites, etc. Cutting and cutting of straight and straight shapes.
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